Postdoctoral Associate -Semiconductor Devices
- Hunan University
- Location: Changsha, China
- Job Number: 7117958
- Posting Date: Dec 11, 2022
- Application Deadline: Open Until Filled
We are looking for candidates with experiences or interest in following areas: electrical engineering, applied physics, semiconductor materials and devices. With the tremendous advancement of organic semiconductors and organic-inorganic hybrid semiconductors, it is promising to utilize the knowledge of semiconductor materials and devices to develop novel devices with simple fabrication processes or fancy functions. We currently have plenty of funding to support the research program.
We provide competitive salary/benefits (annual salary >40000 US dollars, with additional medical insurance), excellent core facilities and a highly interactive group of scientists for individuals who are motivated and capable of conducting research independently. Hunan University and the College of Semiconductors (College of Integrated Circuits) provide comfortable atmosphere for living and working. Hunan University is one of the top public universities in Changsha, China. It is ranked #591-600 in QS World University Rankings 2023 and #401-500 in THE World University Rankings 2023.
Hunan University website:
Hu lab webpage:
Changsha is one of the largest cities in central China. It has a population over 10 million, with advanced medical, transport and living facilities. However, the living cost in Changsha is low. Generally, a two-bedroom apartment costs about $200-300/month, and the cost for food and travel is about $200-300/month.
As a postdoc applicant, candidates should have a Ph.D. degree granted within the past three years, with advanced training in electrical engineering, physics, materials and chemistry. Experience with semiconductor devices is preferred. The successful candidate is expected to be highly motivated, have scientific independence, excellent English speaking and writing skills, and international peer-reviewed publications.
Applicants should submit their curriculum vitae, cover letter with description of current research, and contact information of three references to [email protected]